Interim Report 2019

舜宇光學科技（集團）有限公司 2019 中期報告 9 Management Discussion and Analysis 管理層討論與分析 During the period under review, the shipment volume of handset camera modules of the Group increased by approximately 20.7% compared to that of the corresponding period of last year. Triple-camera has become a popular configuration for high-end smartphones. There are even quadruple-camera and quintuple-camera products in the market. At the same time, the demand for high-magnification optical zoom products is strong and the Group has successfully mass produced the periscope- style handset camera modules with 5-time optical zoom function. In addition, as consumers’ requirements for smartphone image performance is getting higher and higher, the demand for large-aperture technology is also stronger. The Group has been the first mover to mass produce the handset camera modules with ultra-large aperture (FNo.1.4) during the period under review. Meanwhile, the advent of 5G era further promoted the development of 3D sensing and the demand for TOF technology from smartphone brand manufacturers was particularly strong. The Group has mass produced TOF related products in large amounts. In terms of technological innovation, the Group continued to innovate in high-precision alignment technology and self-developed the third-generation active alignment (“ AA ”) technology. In terms of production line processing, the Group has firstly developed the on-line assembly (“ OLA ”) production line, which uses fully automated loading and unloading and material transfer method to achieve automatic production from chip on board (“ COB ”) to AA. In addition, the Group also firstly launched the ultra-thin semiconductor packaging technology (IOM), which could reduce the module size and improve the precision and strength of the module. 於回顧期內，本集團手機攝像模組的出貨量較去 年同期增長約 20.7% 。三攝像頭已成為高端智能 手機的熱門配置，市場上甚至還出現四攝像頭和 五攝像頭的產品。同時，高倍率光學變焦產品需 求強烈，本集團已成功量產具備 5 倍光學變焦功 能的潛望式手機攝像模組。此外，隨著消費者對 智能手機圖像性能的要求越來越高，大光圈技術 的需求也更加強烈。於回顧期內，本集團是業內 首家量產超大光圈（ FNo.1.4 ）手機攝像模組的廠 商。與此同時， 5G 時代的來臨進一步推動了 3D 感應的發展，智能手機品牌廠商對 TOF 技術的需 求尤為強烈，本集團已大量量產 TOF 相關產品。 在技術創新方面，本集團在高精度對準技術上持 續創新，自主研發出第三代主動對準（「 AA 」）技 術。在產線制程方面，本集團首創連線組裝線體 （「 OLA 」），該線體採用全自動上下料及物料傳送 的方式，實現從板上芯片封裝（「 COB 」）到 AA 的 生產自動化。此外，本集團還首推半導體超薄封 裝技術（ IOM ），該技術能減小模組尺寸並提高模 組的精度和強度。